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xMEMS推出1毫米超薄、适合手机及AI芯片整合的“气冷式全硅主动散热芯片”
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芯科科技xG26系列产品为多协议无线设备性能树立新标准
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艾迈斯欧司朗的超低噪声AFE传感器技术有助于增强可穿戴设备对生命体征监测的能力
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