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2024/12/10
xMEMS“气冷式主动散热芯片”荣获CES 2025创新奖
2024/10/21
芯科科技第三代无线开发平台引领物联网发展
2024/08/21
xMEMS推出1毫米超薄、适合手机及AI芯片整合的“气冷式全硅主动散热芯片”
2024/04/11
